Daniela Zaidenberg
MIT EECS | Angle Undergraduate Research and Innovation Scholar
Microwave Package Design for Superconducting Qubits
2021–2022
EECS
- Quantum Computing, Communication, and Sensing
William Oliver
Quantum computing leverages quantum phenomena to improve the time complexity of certain algorithms and perform classically intractable tasks. Because of limited error correction and environmental sensitivity, there are bounds to the gate complexity of quantum algorithms. Likewise, some issues with high-fidelity control of superconducting qubits can be attributed to packaging. Packaging here refers to the physical design and enclosure of quantum processors that address the state of qubits. This project explores designing and characterizing the performance of microwave packages for superconducting qubits whose transition frequencies lie in the microwave regime. The designs produced guard against noise and crosstalk to help increase the number of addressable qubits inside quantum processors.
I am participating in SuperUROP because I want to gain high-level research experience in a long term project for quantum computing. I hope to further my knowledge in quantum information science and am excited to help establish well characterized microwave packaging infrastructure for future experiments.